Shyam Aravamudhan

TitleAssociate Professor

DepartmentJoint School of Nanoscience and Nanoengineering

Phone336-285-2856

Fax336-500-0115

Emailsaravamu@ncat.edu

OfficeThe Joint School of Nanoscience and Nanoengineering
Room: 208G

1601 East Market Street
Greensboro, NC 27411

Shyam Aravamudhan

Education

Ph D: Electrical and Electronics Engineering, University of South Florida, 2007

MS: Electrical Engineering, University of South Florida, 2003

BS: Electrical and Electronics Engineering, University of Madras, 1999


Research Interests

Nanobioelectronics, Regenerative Engineering, 2D Materials, MEMS Sensors and System, Material Toxicity


Recent Publications

Ghazizadeh, Hamed  Aravamudhan, Shyam  (2017).  Two-dimensional in-vitro cell stretch platforms.  (17,  ).  Journal of Mechanics in Medicine and Biology.

Crawford, Steven  Aravamudhan, Shyam  (2016).  Chemical Mechanical Planarization of GaAs: Effect on Physicochemical Characteristics and Toxicity of Post-Process Slurry.  (P088326,  ).  SRC Technical Digest.

Sharma, Ramakrishna  Ruparelia, Priyanka  Kosaraju, Karshak  LaJeunesse, Lifeng  LaJeunesse, Dennis  Aravamudhan, Shyam  (2016).  Enhancement Of Neurite Growth By Sustained Release Of Nerve Growth Factor Using Coaxial Cellulose Acetate Nanofibers.  (22,  pp. S151-S152).  Tissue Engineering Part A .

Kosaraju, Karshak  Lancaster, Jarrett  Crawford, Steven  Aravamudhan, Shyam  Starobin, Joseph  (2016).  Non-invasive evaluation of cardiac repolarization in mice exposed to single-wall carbon nanotubes and ceria nanoparticles via intratracheal instillation.  (3,  3,  pp. 611-618).  Environmental Science: Nano.

Kosaraju, Karshak  Crawford, Steven  Aravamudhan, Shyam  (2015).  Cellular Toxicity Assessment and Environmental Impact of Pre- and Post-CMP Nanoparticle Slurries.  (40,  69,  pp. 1-5).  ECS Transactions.

Samykano, Mahendran  Mohan, Ram  Aravamudhan, Shyam  (2015).  Effect of Current Density and Magnetic Field on the Growth and Morphology of Nickel Nanowires.  MEMS and Nanotechnology, Volume 8   Springer International Publishing.